High-performance thermal fillers including ceramic, carbon-based, and metal oxide powders for advanced heat management

Advancing Thermal Management:
Next-Generation Fillers & Materials

High-performance thermal fillers and interface materials engineered for maximum heat dissipation

From advanced ceramic powders to cutting-edge carbon-based fillers,
we provide the critical components needed to solve the most complex thermal challenges in EV, 5G, and Consumer Electronics.

Explore Thermal Fillers Products

Advanced thermal interface materials such as gap fillers, pastes, and encapsulants for EV and electronic reliability

Precision-Engineered Interface Solutions

Tailored liquids, pads, and encapsulants for mission-critical reliability.

Minimize thermal resistance and protect sensitive electronics with our premium Thermal Interface Materials (TIMs), rigorously tested for maximum efficiency and longevity.

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High Thermal Conductivity

Industry-leading thermal conductivity across a diverse range of Alumina, Boron Nitride, and Graphene fillers for optimized heat transfer.

Custom Formulation & Surface Treatment

Specialized R&D support providing custom particle sizing and advanced surface treatments to ensure perfect resin compatibility.

Rigorous Lab Testing

Comprehensive in-house reliability analysis, rheology, and thermal conductivity testing to guarantee performance under extreme conditions.

Comprehensive Product Portfolio

Advanced thermal materials engineered for optimal heat dissipation.

Thermal Fillers

Silicon-Based Fillers

High-purity silicon-based fillers engineered to provide exceptional thermal stability and superior dielectric insulation for advanced electronic packaging and high-power industrial applications.

Ultra-lightweight hollow glass microspheres with high crush strength for weight-sensitive thermal management applications.

Lightweight Fillers

Innovative low-density fillers designed to achieve high thermal conductivity while significantly reducing overall component weight for aerospace, automotive, and portable electronic systems.

Engineered composite thermal fillers and specialty hybrid materials featuring advanced surface coating and multi-layer particle technology.

Composite & Others

Advanced hybrid composites and specialty functional additives tailored to provide synergistic thermal effects and meet specific requirements for unique, complex heat management challenges.

Thermal Interface Materials (TIMs)

Thermal Grease / Paste

High-performance thermal compounds featuring low bond-line thickness and minimal contact resistance to ensure efficient heat transfer between high-power processors and heat sinks.

Thermal Gel

Fully dispensable thermal gels offering excellent gap-filling capabilities and low mechanical stress for automated high-volume production and complex component surface topographies.

Thermal Pad

Soft and highly conformable interface pads available in various thicknesses to bridge large gaps and provide reliable cooling for diverse electronic components.

Phase Change Materials

Advanced materials that transition to liquid at operating temperatures to achieve ultra-low thermal resistance and superior reliability without pump-out or dry-out issues.

Thermally conductive potting compounds for electronic module encapsulation and protection.

Thermal Potting Compounds

Versatile liquid encapsulants designed for full-body protection and heat dissipation, ensuring environmental sealing and structural integrity for power supplies, sensors, and automotive modules.

Double-sided thermally conductive adhesive tape for mechanical attachment and heat transfer.

Thermal Tape

Thermally conductive adhesive tapes providing strong mechanical attachment and efficient heat transfer, eliminating the need for traditional mechanical fasteners or clips during assembly.

Expert Technical Services & Lab Validation

Accelerate your product development with our specialized R&D expertise and precision testing capabilities.

Custom Material Formulation

From particle size distribution to high-loading compounding, we engineer bespoke thermal materials tailored to your specific application requirements.

LEARN CUSTOM FORMULATION

Advanced Surface Treatment

Optimize filler compatibility and resin stability with our proprietary surface modification technologies for various conductive fillers.

EXPLORE SURFACE MODIFICATION TECHNOLOGY

Thermal Analysis & Testing

Professional thermal conductivity measurement, rheology profiling, and comprehensive material performance analysis to ensure reliability.

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Powering Critical Industries

Advanced thermal management solutions for the world's most demanding technology sectors.

Advanced battery thermal management system for EVs using amber-glowing thermal gap fillers and potting compounds to prevent thermal runaway.

EV & Battery

Comprehensive thermal protection for EV power packs using advanced Thermal Pads, Potting Compounds, and highly conductive Ceramic Fillers to efficiently dissipate heat and prevent thermal runaway.

Thermal RunawayGap Fillers

Semiconductor

Semiconductor Packaging

High-purity fillers including Aluminum Nitride (AlN) and Spherical Silica engineered for EMCs and advanced chip packaging, ensuring ultra-low thermal resistance.

AlN PowderEMC Fillers

High-performance cooling solutions for 5G base stations and data centers using thermal grease and silicone elastomers to manage intense heat loads.

5G & Telecom

5G & Telecom Cooling

Reliable heat dissipation for outdoor base stations and data centers utilizing our high-performance Thermal Greases and Thermal Potting Compounds.

Base StationsThermal Paste

Ultra-thin graphene and carbon-based heat spreaders providing advanced thermal management for high-performance smartphones and laptops.

Consumer Tech

Consumer Electronics

Ultra-thin, lightweight thermal management for smartphones and laptops driven by our advanced Graphene, Graphite, and Carbon Nanotubes (CNTs).

GrapheneHeat Spreaders