Alumina
| Cat | Products Name | Price |
|---|---|---|
| TFCFAA-0011 | Alumina (D10, 3.25 μm) | |
| TFCFAA-0012 | Alumina (D10, 4.52 μm) | |
| TFCFAA-0013 | Alumina (D10, 9.28μm) | |
| TFCFAA-0014 | Alumina (D10, 16.16 μm) | |
| TFCFAA-0015 | Alumina (D10, 21.98 μm) | |
| TFCFAA-0016 | Alumina (D10, 51.54 μm) | |
| TFCFAA-0017 | Alumina (D10, 1.5 μm) | |
| TFCFAA-0018 | Alumina (D10, 1.49 μm) | |
| TFCFAA-0019 | Alumina (D10, 2.33 μm) | |
| TFCFAA-0020 | Alumina (D10, 4.18 μm) |
Alumina, also known as aluminum oxide, stands as the premier choice in the realm of thermal interface materials (TIMs) and thermally conductive polymers. It perfectly balances remarkable thermal conductivity with superior electrical insulation, making it the indispensable backbone for protective encapsulants, potting compounds, and thermal pads. Unlike metallic fillers that compromise electrical isolation, or alternative ceramic fillers that may introduce exorbitant costs or processing difficulties, our alumina products offer unparalleled versatility, reliability, and cost-effectiveness.
At AIMRSE, we understand that no single filler geometry can address the multifaceted challenges of diverse industrial applications. Our aluminum oxide powders with controlled morphology — spherical, near-spherical, platelet, and angular. From high-flow TIMs to cost-optimized encapsulants, AIMRSE delivers the right alumina for your heat dissipation challenge.
Precision Morphology Control
AIMRSE's alumina products are manufactured through advanced synthesis and classification techniques that ensure tight control over shape, surface area, and impurity profile — without compromising lot-to-lot consistency. Every morphology is optimized for specific rheological and thermal demands: spherical alumina for ultra-high filler loading, platelet alumina for anisotropic conductivity, and angular alumina for cost-sensitive, high-volume applications. Our R&D team continuously refines particle engineering to help formulators achieve lower thermal resistance and improved reliability.
Spherical Alumina
High sphericity · low viscosity
Perfectly spherical particles enable maximum packing density and exceptional flowability. Ideal for high-performance thermal greases, gap fillers, and two-part adhesives where filler loading exceeds typical limits without sacrificing processability. The smooth surface minimizes equipment abrasion and ensures uniform heat transfer.
Near-Spherical Alumina
Balanced performance & cost
Combining high circularity with economical processing, near-spherical alumina offers an excellent compromise between viscosity control and formulation cost. It is widely adopted in thermal pads, phase change materials, and potting compounds. The particle shape ensures reliable thermal conductivity while maintaining easy dispersion.
Platelet Alumina
High aspect ratio · directional heat
Characterized by thin, flat platelets that enhance in-plane thermal conductivity. This morphology is especially beneficial for thermal tapes, coatings, and gap fillers where lateral heat spreading is critical. The overlapping platelet structure also improves mechanical reinforcement and reduces sedimentation in liquid resins.
Angular Alumina
Irregular · robust & economical
Angular alumina features irregular, sharp-edged particles that contribute to strong mechanical interlocking within composite systems. This structure enhances mechanical strength and wear resistance. It is particularly suitable for applications where durability and structural integrity are important, such as adhesives, sealants, and industrial components.
Our Advantages
Choosing AIMRSE means partnering with a global leader dedicated to the frontier of material science. We combine deep technical expertise with a customer-centric approach, delivering high-performance alumina fillers that empower your innovations and secure your competitive edge in a rapidly evolving market.
Our alumina undergoes proprietary surface treatments with specialized silanes and coupling agents. This ensures flawless wetting and dispersion within silicone, epoxy, or polyurethane resins, preventing particle agglomeration and settling.
Electrical reliability is non-negotiable. Our alumina is refined to eliminate trace magnetic substances and ionic impurities, ensuring consistent dielectric properties and preventing electrochemical migration in high-voltage environments.
By optimizing morphology, we provide fillers that maintain high fluidity even at extreme loading levels. This allows for faster dispensing, better mold filling, and reduced cycle times in automated production lines.
Our materials are engineered to maintain their structural and chemical properties across a wide temperature range, ensuring that your thermal management solutions remain stable from cryogenic conditions to extreme high-heat industrial environments.
We don't believe in a one-size-fits-all approach. AIMRSE works closely with your R&D teams to customize the morphology and treatment of the alumina to match your proprietary resin systems and manufacturing methods specifically.
In an era of market volatility, AIMRSE provides a cornerstone of stability for your production. We have cultivated a robust, integrated supply chain that spans key global regions, ensuring that our Alumina fillers are available when and where you need them.
Core Applications
By enabling efficient heat transfer across diverse formats, our alumina fillers empower engineers to solve complex cooling challenges in the most demanding electronic, automotive, and industrial environments.
Thermal Gap Pads
Enables high thermal conductivity and low interfacial resistance in conformable, electrically insulating pad materials for power electronics.
Potting Compounds
Enhances heat dissipation in electronic encapsulation while maintaining flowability and minimizing stress on sensitive components.
Thermal Greases
Delivers ultra-thin bond lines and maximum thermal transfer in dispensable interface materials for CPUs and power modules.
Thermally Conductive Adhesives
Provides structural bond strength with reliable heat dissipation for LED assembly and semiconductor die attach.
Phase Change Materials
Ensures consistent wet-out and stable thermal performance across operating temperature cycles in reusable thermal interfaces.
Epoxy Molding Compounds
Improves thermal conductivity in semiconductor packaging while preserving mold flow and low-stress properties.
Frequently Asked Questions
Why Should I Choose Spherical Alumina over Angular Types?
Can AIMRSE Provide Surface-Treated Alumina?
How Does Alumina Compare to Other Fillers like Boron Nitride or Silicon Carbide?
What Impact Does Purity Have on My Final Product?
How Does Morphology Affect the Final Thermal Conductivity?
Partner with AIMRSE
Whatever thermal management challenges you are facing, our team is ready to provide you with expert technical support and high-performance materials. Let's drive the future of thermal management technology together.
Related Products
Technical data represent typical values. As applications vary, we recommend consulting our technical team to ensure the best fit for your specific requirements.
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