Nano Graphene Platelets
Catalog NO.: TFCBFC-0018 Category: Graphene & Related 2D Materials
Nano graphene platelets are high-purity carbon nanomaterials (> 99.5wt%) characterized by an ultra-high aspect ratio. These platelets exhibit outstanding thermal, electrical, and mechanical properties. Designed as a high-performance functional filler, they are capable of significantly enhancing the thermal and electrical conductivity of host matrices while providing inherent lubrication, corrosion resistance, and exceptional stability at high temperatures.
| Purity | > 99.5wt% |
| Thickness | 4 - 20 nm |
| Diameter | 5 - 10 μm |
| Density | 0.23 g/cm3 |
◈ Exceptional Thermal and Electrical Conductivity: Features a very low volume resistivity, making it a superior additive for boosting heat transfer and electrical paths in composite materials.
◈ Ultra-High Aspect Ratio: The large diameter-to-thickness ratio enables the formation of efficient reinforcement and conductive networks within a matrix even at low loading levels.
◈ High Purity and Neutral pH: With a purity exceeding 99.5wt% and a stable pH between 7.00 and 7.65, it ensures chemical compatibility and minimal interference with sensitive resin systems.
◈ Multi-functional Protective Properties: Provides excellent lubricity, resistance to chemical corrosion, and maintains structural integrity in extreme high-temperature environments.
Thermal Interface Materials (TIMs): Ideal for use as a high-efficiency conductive filler in thermal adhesives, thermal gels, and high-polymer composites for advanced heat dissipation.
Conductive Plastics and Rubbers: Applied in the manufacturing of functional polymers requiring high electrical conductivity and reliable mechanical reinforcement.
Anti-static Materials: Used in the development of anti-static coatings and industrial components to prevent electrostatic discharge in sensitive electronic environments.
High-Temperature Lubricants: Utilized as a solid lubricant additive to reduce friction and wear in mechanical systems operating under high-load or high-heat conditions.
Advanced Electronic Packaging: Suitable for use in heat-sink materials and protective housings for high-power electronics and telecommunications equipment.
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