Phase Change Materials (3.3 W/m·K)
Catalog NO.: TIMPCM-0004 Category: Phase Change Materials
This is a high-performance thermal interface material designed to provide efficient heat transfer for a variety of electronic cooling applications. It is formulated to deliver reliable thermal conductivity and stability across a range of operating conditions.
| Color | Grey |
| Thickness | 0.13 mm |
| Thermal Conductivity | 3.3 ± 10% W/m·K |
| Volume Resistivity | 3 × 1011 Ω·cm |
| Density | 3.4 ± 0.3 g/cm3 |
| Breakdown Voltage | ≥ 1 kV/mm |
| Operating Temperature | - 40 - 125°C |
| Phase Change Temperature | 50 °C |
◈ Reliable Thermal Conductivity: Provides consistent heat transfer for electronic cooling applications.
◈ Stable Performance: Formulated for long-term stability and reliable operation.
◈ Effective Gap Filling: Conforms to surface irregularities for optimal thermal contact.
◈ Wide Application Range: Suitable for various thermal management requirements in electronics.
Electronic Components: Thermal interface for various heat-generating components.
Power Electronics: Cooling for power modules and converters.
Consumer Electronics: Heat dissipation for laptops, desktops, and other consumer devices.
Telecommunications Equipment: Thermal management for networking hardware.
General Gap Filling: Versatile thermal interface for electronic assemblies.
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