Phase Change Materials (8.5 W/m·K)
Catalog NO.: TIMPCM-0001 Category: Phase Change Materials
This is a high-performance phase change material (PCM) designed to provide an ultra-low thermal resistance path between heat-generating components and heat sinks. It transitions from a solid to a semi-liquid state at a specific temperature, effectively filling microscopic irregularities to maximize heat transfer.
| Color | Dark Grey |
| Thickness | 0.2 - 0.5 mm |
| Thermal Conductivity | 8.5 ( ± 0.5) W/m·K |
| Density | 2.8 ( ± 0.3) g/cm3 |
| Operating Temperature | - 40 - 125°C |
| Phase Change Temperature | 50 ( ± 5)°C |
◈ Phase Change Technology: Transitions at approximately 50°C to flow and fill microscopic gaps, minimizing contact thermal resistance.
◈ Ultra-Low Thermal Resistance: Achieves extremely low thermal resistance for high-performance cooling.
◈ High Thermal Conductivity: Provides efficient heat transfer for demanding applications.
◈ Solid at Room Temperature: Supplied as a solid pad for easy handling and precise placement during assembly.
◈ Clean and Non-Corrosive: Leaves no messy residue and is safe for use with sensitive electronic components.
High-Power CPUs and GPUs: Ideal for maximizing heat dissipation in high-performance computing and graphics cards.
AI Servers and Data Centers: Efficient thermal management for high-density computing environments.
Automotive Electronics: Reliable cooling for onboard chargers, ECUs, and power modules.
5G Communication Modules: Thermal management for high-frequency base stations and network equipment.
Power Electronics: Heat dissipation for IGBTs, MOSFETs, and other power semiconductors.
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