Phase Change Materials (9.5 W/m·K)
Catalog NO.: TIMPCM-0002 Category: Phase Change Materials
This is a high-performance phase change thermal interface material designed for efficient heat transfer in demanding electronic applications. It features a low thermal impedance and is engineered to fill gaps effectively, providing reliable cooling for high-power devices.
| Color | Grey |
| Thickness | ~ 0.2 mm |
| Thermal Conductivity | 9.5 W/m·K |
| Density | 2.55 g/cm3 |
| Operating Temperature | - 50 - 140°C |
| Phase Change Temperature | 45°C |
◈ Phase Change Technology: Engineered to transition at a specific temperature to achieve excellent gap filling and surface wetting.
◈ Low Thermal Impedance: Minimizes interfacial thermal resistance for efficient heat transfer.
◈ Gap Filling Capability: Effectively fills microscopic gaps and surface irregularities to ensure optimal thermal contact.
◈ High-Performance Cooling: Designed to meet the thermal management needs of advanced electronics.
AI Servers: Thermal management for high-performance AI computing modules.
Electric Vehicles: Cooling for battery packs and power electronics in EVs.
5G Modules: Heat dissipation for 5G communication equipment.
Energy Storage Systems: Thermal interface for grid-scale and commercial energy storage.
High-Power Devices: Suitable for applications requiring efficient and reliable heat dissipation.
Contact Form
