Thermal Fillers for Potting Compounds (D50, 7.04 μm)
Catalog NO.: TFTFSP-0010 Category: Others
This product is a high-performance thermal conductive agent formulated from premium inorganic materials and treated with a specialized surface coating process. It is specifically designed to ensure exceptional dispersibility within silicone systems. By optimizing particle interactions, it provides a highly effective solution for formulating addition-cure potting compounds with a targeted thermal conductivity.
| Appearance | White powder |
| Particle Size D50 | 7.04 μm |
| PH | 8.04 |
| Moisture | 0.25% |
| Oil Absorption Value | 16.06 g/100g |
| Whiteness | 94.8% |
◈ Advanced Surface Modification: Treated to achieve low oil absorption and excellent dispersion in silicone, minimizing the thickening effect and enabling the formulation of low-viscosity, excellent-leveling potting compounds.
◈ Efficient Thermal Network: Engineered to easily form a dense and highly efficient thermal conductive pathway within the silicone matrix, delivering outstanding heat dissipation performance.
◈ High Purity and Insulation: Features a high-purity composition that ensures superior dielectric properties and reliable electrical insulation, providing critical protection for sensitive electronic components.
Addition-Cure Potting Compounds: Specifically developed as the primary functional filler for formulating thermally conductive addition-cure potting compounds.
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