Thermal Paste (1.9 W/m·K)
Catalog NO.: TIMTGP-0004 Category: Thermal Grease / Paste
This is a thermal paste designed to assist heat sinks in dissipating heat from electronic components. It is applied in a thin layer to minimize thermal interface material thickness, thereby reducing thermal resistance. It provides a reliable thermal interface for various electronic applications.
| Color | White |
| Thermal Conductivity | 1.9 ± 10% W/m·K |
| Viscosity | 200 ± 80 Pa·s |
| Volume Resistivity | > 1011 Ω·cm |
| Density | 2.2 ± 5% g/cm3 |
| Operating Temperature | - 40 - 180°C |
| Weight Loss | < 0.5% |
◈ Good Thermal Conductivity: Provides efficient heat transfer for general electronic cooling.
◈ Thin Layer Application: Applied thinly to minimize thermal resistance.
◈ Easy to Assemble: Simple and straightforward application process.
◈ High Stability: Formulated for consistent performance and reliability.
◈ Wide Application Range: Suitable for a variety of electronic devices.
Electronic Components: Thermal interface for ICs and other heat-generating components.
Consumer Electronics: Heat dissipation for laptops, desktops, and other consumer devices.
Industrial Equipment: Thermal management for power supplies and controllers.
LED Lighting: Cooling for LED modules and fixtures.
General Electronics Cooling: Versatile thermal paste for various applications.
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