Thermal Paste (5.3 W/m·K)
Catalog NO.: TIMTGP-0003 Category: Thermal Grease / Paste
This is a thermal paste designed to assist heat sinks in dissipating heat from electronic components. It is applied in a thin layer to minimize thermal interface material thickness, thereby reducing thermal resistance. It is a versatile product suitable for a wide range of non-high-power applications.
| Color | Grey |
| Thermal Conductivity | 5.3 ± 10% W/m·K |
| Viscosity | 150 ± 50 Pa·s |
| Volume Resistivity | > 1012 Ω·cm |
| Density | 2.95 ± 5% g/cm3 |
| Operating Temperature | - 40 - 180°C |
| Weight Loss | < 0.5% |
◈ Good Thermal Conductivity: Provides efficient heat transfer for general electronic cooling.
◈ Thin Layer Application: Applied thinly to minimize thermal resistance.
◈ Easy to Assemble: Simple and straightforward application process.
◈ High Stability: Formulated for consistent performance and reliability.
◈ Wide Application Range: Suitable for robots, 3C electronics, and similar products.
Robots: Thermal management for robotic control systems and motor drives.
3C Electronics: Heat dissipation for computers, communication devices, and consumer electronics.
Electronic Components: General thermal interface for IC wafers and other components.
Non-High-Power Products: Ideal for applications with moderate heat dissipation requirements.
Consumer Devices: Cooling for various consumer electronic products.
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