12 Inch Backside Metal PVD System
Catalog NO.: AIMRSE-NRDE-033 Category: Nanotechnology R&D Equip
12 Inch Backside Metal PVD System is a 12-inch PVD system for backside metal film deposition. Built on a cluster tool architecture, it integrates atmospheric platform, vacuum transfer, degas, pre-clean, and multiple process chambers for fully automated, high-volume production in packaging and power device applications.
◈ The unique magnetron sputtering source and chamber structure design effectively improves target utilization.
◈ Flexible chamber configuration and optimized process flow result in high throughput and low operating costs.
◈ An optimized and stable transfer system for power semiconductors, compatible with various substrate types including warped wafers, bonded wafers, and thin wafers.
◈ Excellent particle and stress control capabilities.
Specifically for backside metal film deposition.
Contact Form
