12/8-Inch Photoresist Dry Descaling
Catalog NO.: AIMRSE-NRDE-047 Category: Nanotechnology R&D Equip
12/8-Inch Photoresist Dry Descaling features a twin-chamber design, high-efficiency ion filter, and multi-gas system for post-etch residue removal, high-dose implant strip, hard mask removal, and surface treatment with minimal substrate damage.
◈ Twin-Chamber Design: For increased throughput.
◈ Low Damage: High-efficiency ion filter minimizes plasma damage to underlying materials.
◈ Versatile Processing: Capable of post-etch residue removal, high-dose implant strip, hard mask removal, and surface treatment.
◈ High-Volume Production Ready: Configured with a 3-chamber platform and intelligent algorithm system for mass production.
8/12-inch wafer processing for photoresist removal, residue cleaning, and surface treatment in high-volume manufacturing.
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