8 Inch Deep Silicon Etcher
Catalog NO.: AIMRSE-NRDE-064 Category: Nanotechnology R&D Equip
8 Inch Deep Silicon Etcher is mainly used for 4/6/8-inch deep silicon dry etching processes. Equipped with manual or automatic transfer systems, it is suitable for different scenarios such as MEMS device R&D, pilot lines, and mass production. The product features high-density dual plasma sources, center-edge gas inlet, fast gas switching, and a low-frequency pulsed lower electrode system.
◈ Capable of switching between 4/6/8-inch sizes.
◈ High-density dual-dimensional plasma source design.
◈ Fast gas switching.
◈ Center and edge gas inlet for excellent uniformity.
◈ RF at 400K with pulse functionality.
MEMS, integrated circuits, advanced packaging.
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