Addition-curing Silicone Gel
Catalog NO.: AIMRSE-FOA-074 Category: Electronic Encapsulants
Addition-curing Silicone Gel is a two-component, addition-curing silicone gel characterized by its low viscosity and high transparency. It can cure at room temperature or with heat, and is designed for protective potting applications where flexibility and minimal magnetic interference are required. It operates reliably in a wide temperature range from -60°C to 220°C.
| Appearance | Colorless and transparent |
| Viscosity | 800-1200 cP |
| Dielectric Constant | ≥ 12 kV/mm |
| Volume Resistivity | ≥ 10 12 Ω·cm |
| Mix Ratio By Weight | 1:1 |
◈ Low Viscosity & Transparent: Has a very low mixed viscosity of 800-1,200 cps and cures into a colorless, transparent gel.
◈ Protective & Flexible: Offers good flexibility, providing effective dustproof, moisture-proof, shock-proof, and insulation protection. It also has minimal magnetic permeability, making it suitable for components sensitive to magnetic fields.
◈ Wide Operating Temperature: Suitable for long-term use from -60°C to 220°C.
◈ Material Compatibility: Safe for use on a wide range of surfaces, including PC, PP, ABS, PVC, and various metals.
Primarily used for protective potting requiring buffering and environmental sealing:
Potting of power modules for waterproof and moisture-proof protection.
Buffer protection for other electronic components, where shock absorption and stress relief are needed.
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