Alumina Ceramic Etching Ring (95%)
Catalog NO.: AIMRSE-SEC-001 Category: Specialty Electronic Ceramics
Alumina Ceramic Etching Ring is a core consumable in semiconductor dry etching equipment, playing a crucial role in wafer processing due to its material properties. Its high-temperature resistance and plasma corrosion resistance are particularly outstanding: in etching environments above 1300℃, the 95% pure alumina ceramic maintains structural stability and can withstand the erosion of highly corrosive plasmas such as fluorine-based and chlorine-based plasmas. Its service life is 3-5 times longer than that of metal rings, significantly reducing the frequency of equipment downtime for replacement.
| Density | 3.7 g/cm3 |
| Compressive Strength | 2000 MPa |
| Poisson's Ratio | 0.23 |
| Young's Modulus | 300 GPa |
| Flexural Strength | 350 MPa |
| Coefficient of Thermal Expansion | 7.5 10-6/K |
| Fracture Toughness | 3 GPa |
| Vickers Hardness | 13.7 GPa |
| Dielectric Constant | 9 1MHz |
| Dielectric Loss | 7.9 1MHz |
| Thermal Conductivity | 20 W/(m·k) |
| Specific Heat Capacity | 750 (J/kg·K) |
| Breakdown Voltage | 50 kv/mm |
| Volume Resistivity | 10 12 Ω·cm |
| Size | Customizable |
| Machining Accuracy | 0.01 mm |
| Roughness | 0.1 μm |
| Material Composition | Alumina ceramic |
| Elastic Modulus | 350 MPa m1/2 |
◈ High Purity Alumina: Typically made from high-purity alumina.
◈ Excellent Thermal Stability: Maintains structural stability in high-temperature etching environments (e.g., > 1300°C).
◈ Superior Plasma Corrosion Resistance: Withstands strong corrosive plasmas (e.g., fluorine-based, chlorine-based), extending service life significantly compared to metal rings.
◈ High Precision: Manufactured with high machining precision and low surface roughness.
◈ Customizable: Can be customized according to customer drawings.
Semiconductor dry etching equipment.
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