Alumina Support Ring
Catalog NO.: AIMRSE-SEC-005 Category: Specialty Electronic Ceramics
Alumina Support Ring is a critical precision component in semiconductor etching and deposition processes, and is replacing metal and plastic structures due to its inherent material advantages. Its primary value lies in its ultra-high dimensional stability: alumina has a low coefficient of thermal expansion and high hardness, allowing for micron-level roundness control after precision grinding. This ensures the wafer maintains precise concentricity during heating and cooling cycles, effectively suppressing yield losses caused by edge deviations. Secondly, alumina possesses excellent electrical insulation and plasma corrosion resistance, with a breakdown voltage exceeding 20 kV. It exhibits excellent chemical inertness to high-energy plasmas containing fluorine and chlorine, allowing for stable operation for thousands of hours in cavities, significantly reducing the risk of particulate contamination and metal ion precipitation. Its thermal conductivity is approximately 30-40 W/m·K, enabling rapid and uniform dissipation of process heat, preventing wafer warpage caused by localized hot spots.
| Size | Customizable |
| Machining Accuracy | 0.01 mm |
| Roughness | 0.05 μm |
| Material Composition | Alumina ceramic |
◈ High Dimensional Stability: Low thermal expansion coefficient and high hardness ensure micron-level roundness and precise wafer concentricity during temperature cycles.
◈ Excellent Electrical Insulation: High breakdown voltage prevents electrical issues.
◈ Superior Plasma Corrosion Resistance: Exhibits excellent chemical inertness to high-energy plasmas, reducing particle contamination and metal ion release.
◈ Good Thermal Conductivity: Thermal conductivity allows for rapid heat dissipation, avoiding local hot spots and wafer warpage.
◈ High Precision: Manufactured with high machining precision and low surface roughness.
Semiconductor etching and deposition equipment for wafer alignment and support.
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