Atomic Layer Deposition PEALD System
Catalog NO.: AIMRSE-NRDE-019 Category: Nanotechnology R&D Equip
Atomic Layer Deposition PEALD System is an atomic layer deposition system. It can be configured with up to 3 dual-station reaction chambers and is used in advanced chip manufacturing and advanced packaging (TSV), offering films like PEALD SiO₂ and SiN.
◈ High Step Coverage: Achieves step coverage up to 95% at high aspect ratios.
◈ Excellent Film Properties: Delivers excellent film properties with good cost of ownership.
◈ Superior Uniformity: Provides excellent film uniformity and great shape retention.
Advanced chip manufacturing, advanced packaging (TSV), and front-end-of-line processes require high-quality ALD films like SiO2 and SiN.
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