Atomic Layer Deposition System
Catalog NO.: AIMRSE-NRDE-014 Category: Nanotechnology R&D Equip
Atomic Layer Deposition System is a 12-inch single-wafer thermal ALD production tool designed for high-k dielectric films. It meets process requirements for gate oxides, MIM capacitor insulators, and TSV dielectric layers, utilizing original reactor and source delivery systems.
◈ High-k Film Specialization: Designed for high-k dielectric films like Al2O3, HfO2, HfSiO, SiO2, and metallization.
◈ Single-Wafer Thermal ALD: 12-inch single-wafer thermal ALD production tool (compatible with 8-inch).
◈ Superior Uniformity & Conformality: Original reactor design ensures excellent film uniformity and repeatability, suitable for 3D and high-aspect-ratio structures.
◈ Multi-Source Capability: Equipped with 4 independent high-temperature precursor delivery systems for diverse doping needs.
◈ Precise Control: Provides atomic-level control for critical thin films.
Logic and memory chip manufacturing requires high-k dielectric layers, gate oxides, MIM capacitor insulators, and TSV dielectric layers.
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