Batch Atomic Layer Deposition System
Catalog NO.: AIMRSE-NRDE-016 Category: Nanotechnology R&D Equip
Batch Atomic Layer Deposition System features an innovative mini-batch chamber design capable of processing 25 pieces of 12-inch wafers per run. It is suitable for critical processes requiring low deposition rates, high thickness, and high throughput, offering high speed, small footprint, and low cost of ownership.
◈ Batch Processing: Processes 25 pieces of 12-inch (compatible with 8-inch) wafers per run.
◈ High Throughput & Low CoO: Designed for high-productivity processes with fast deposition speed, small footprint, and low cost of ownership.
◈ Low Thermal Budget: Reduces particle generation and lowers thermal budget compared to furnace-type tools, minimizing thermal damage.
◈ High-Aspect-Ratio Capability: Particularly suitable for mass production on devices with ultra-high aspect ratio structures.
◈ Wide Material Range: Deposits films such as Al2O3, HfO2, and SiO2.
Mass production solutions for memory chips, Micro-OLED displays, MEMS, and other devices requiring thick films or low deposition rates.
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