Chemical Vapor Deposition (CVD) System
Catalog NO.: AIMRSE-NRDE-015 Category: Nanotechnology R&D Equip
Chemical Vapor Deposition (CVD) System utilizes self-developed chambers and integrated electrical/software controls. It is widely used in logic, memory, advanced packaging, and display device manufacturing, meeting diverse functional thin film deposition needs.
◈ High-Precision Pressure Control: Enhances film step coverage.
◈ Composition Control: Allows control of film composition and structure for multi-doping processes.
◈ Edge Control Technology: High-precision process edge control reduces wafer edge exclusion and improves utilization.
◈ High-Temperature Capability: ESC multi-zone heated ceramic chuck enables high-temperature processes and reduces backside deposition.
◈ Contamination Control: Multi-zone purge design reduces particle contamination and extends cleaning cycles.
◈ Excellent Uniformity: Multi-zone temperature control ensures high temperature precision and good film uniformity.
Chip manufacturing in logic, memory, advanced packaging, and display devices for depositing various functional thin films.
Contact Form
