Deep Silicon Etcher
Catalog NO.: AIMRSE-NRDE-061 Category: Nanotechnology R&D Equip
Deep Silicon Etcher is a 12-inch etching equipment developed based on inductively coupled plasma technology, configurable with up to 4 reaction chambers. Based on a high-density plasma source, well-designed chamber hardware, and process capabilities, it provides efficient and precise etching depth, uniformity control, and cross-wafer stability for deep silicon etching applications.
◈ High-density plasma, ultra-high silicon etching rate.
◈ Independent control of plasma density and energy.
◈ Ultra-large chamber volume and high-speed molecular pump.
◈ Precision chamber temperature control system.
◈ Dual-zone temperature control system.
Advanced packaging.
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