High Thermal Conductivity Potting Compound
Catalog NO.: AIMRSE-FOA-075 Category: Electronic Encapsulants
High Thermal Conductivity Potting Compound is a two-component, addition-curing silicone high thermal conductivity potting compound characterized by its low viscosity. It can be cured at room temperature or with heat, with the characteristic that higher temperatures lead to faster curing. The curing reaction produces no by-products, making it safe for use on various material surfaces. It is suitable for long-term operation in environments ranging from -40°C to 200°C.
| Viscosity | 3000-5000 cP |
| Dielectric Constant | ≥ 13 kV/mm |
| Thermal Conductivity | ≥ 2.0 W/(m·k) |
| Hardness | 30-40 |
| Volume Resistivity | ≥ 10 13 Ω·cm |
| Mix Ratio By Weight | 1:1 |
◈ High Thermal Conductivity & Low Viscosity: Offers good heat dissipation with a thermal conductivity of ≥2.0 W/m·K, while maintaining a relatively low mixed viscosity of 3,000-5,000 cps for better flow.
◈ Material Compatibility: Safe for use on a wide range of surfaces, including PC, PP, ABS, PVC, and various metals.
◈ Flexible Curing: Can be cured at room temperature (working time 60-90 min) or accelerated with heat.
Primarily used for protective potting requiring buffering and environmental sealing:
Potting of power modules for waterproof and moisture-proof protection.
Buffer protection for other electronic components, where shock absorption and stress relief are needed.
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