High Thermal Conductivity Silicone Gel (2.00 ± 0.10 g/cm3)
Catalog NO.: AIMRSE-FOA-077 Category: Electronic Encapsulants
High Thermal Conductivity Silicone Gel is a two-component, addition-curing, high thermal conductivity silicone gel with a paste-like consistency. It is designed for heat curing, with the characteristic that higher temperatures lead to faster curing. The curing reaction produces no by-products, making it safe for use on various material surfaces. It is suitable for long-term operation in environments ranging from -40°C to 200°C.
| Density | 2.00 ± 0.10 g/cm3 |
| Appearance | A: Light red B: Grey |
| Dielectric Constant | ≥ 6 kV/mm |
| Thermal Conductivity | ≥ 2.0 W/(m·k) |
| Hardness | 45-55 |
| Volume Resistivity | ≥ 10 13 Ω·cm |
| Mix Ratio By Weight | 1:1 |
◈ High Thermal Conductivity: Provides effective heat dissipation with high thermal conductivity and high electrical impedance.
◈ Paste-like & Stable: Has a paste-like consistency before curing and cures into a stable silicone gel with no low-molecular-weight volatile substances.
◈ Flexible Curing: Can be cured at room temperature or accelerated with heat.
◈ Material Compatibility: Safe for use on a wide range of surfaces in, including PC, PP, ABS, PVC, and various metals.
◈ Environmentally Friendly: Fully complies with EU RoHS and REACH directives.
◈ Wide Temperature Range: Reliable for long-term use from -40°C to 200°C.
Specifically designed for filling gaps and heat dissipation between battery packs in new energy vehicles (NEVs) .
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