High-Throughput Dielectric PECVD Equipment

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High-Throughput Dielectric PECVD Equipment

Catalog NO.: AIMRSE-NRDE-018 Category: Nanotechnology R&D Equip

High-Throughput Dielectric PECVD Equipment is independently developed for high throughput, especially for long-deposition-time processes. It achieves technological breakthroughs in film uniformity, roughness, stress control, particle control, and productivity.

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High Productivity Design: Designed for high throughput with fast switching between multiple film types.
Long Process Capability: Realizes high throughput for processes requiring long deposition times.
High-Temperature Deposition: Meets requirements for high-temperature deposition in the 300-600°C range.
Multi-Wafer Chamber: Process chamber can be used for multiple wafer deposition.

High-volume manufacturing of dielectric films, particularly required for processes requiring long deposition times.

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