High Vacuum Multi-Chamber Thin Film Deposition System
Catalog NO.: AIMRSE-NRDE-013 Category: Nanotechnology R&D Equip
High Vacuum Multi-Chamber Thin Film Deposition System is an advanced platform integrating multiple process chambers, including magnetron sputtering, electron beam evaporation, thermal evaporation, ALD, and various pre/post-treatment modules. It features automated sample transfer, high precision control, and can be equipped with EFEM for Fab cleanroom integration, suitable for complex multi-layer film deposition in R&D, pilot, and mass production.
◈ Multi-Chamber Design: Multiple interconnected process chambers for complex, multi-step deposition without breaking vacuum.
◈ Integrated Process Technologies: Includes magnetron sputtering, electron beam evaporation, thermal evaporation, ALD, and ion beam-assisted deposition.
◈ High/Ultra-High Vacuum: Each process chamber maintains a high or ultra-high vacuum environment.
◈ Fully Automatic Control: PLC+PC controls all process flows.
◈ High Precision: High-precision control of deposition rate and film thickness ensures excellent uniformity and repeatability.
Versatile Material Deposition: Capable of depositing metals, semiconductors, and dielectric materials for single-layer, multi-layer, and alloy films.
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