Low Stress, Two-Component, Silicone Potting Compound
Catalog NO.: AIMRSE-FOA-065 Category: Electronic Encapsulants
Low Stress, Two-Component, Silicone Potting Compound is a two-component, addition-curing silicone potting gel (silicone gel) characterized by low stress. It can be cured at room temperature or with heat, with the characteristic that higher temperatures lead to faster curing. The curing reaction produces no by-products, making it safe for use on various material surfaces. It is suitable for long-term operation in environments ranging from -40°C to 200°C.
| Density | AIMRSE | AeroTherm Two-Component Silicone Potting Gel is a two-component, addition-curing silicone potting gel characterized by low stress. It can be cured at room temperature or with heat, with the characteristic that higher temperatures lead to faster curing. The curing reaction produces no by-products, making it safe for use on various material surfaces. It is suitable for long-term operation in environments ranging from -40°C to 200°C. |
| Appearance | A: Grey B: White |
| Viscosity | 1500-2500 cP |
| Dielectric Constant | ≥ 12 kV/mm |
| Thermal Conductivity | ≥ 0.5 W/(m·k) |
| Hardness | 30-40 |
| Volume Resistivity | ≥ 10 12 Ω·cm |
| Mix Ratio By Weight | 1:1 |
◈ Low Stress & Gel Type: Cures into a soft silicone gel (Shore 00 30-40) that exerts minimal mechanical stress on sensitive components.
◈ Material Compatibility: Safe for use on a wide range of surfaces, including PC, PP, ABS, PVC, and various metals.
◈ Flexible Curing: Can be cured at room temperature (with controllable cure time based on temperature) or accelerated with heat.
Primarily used for potting, heat dissipation, and protection of:
Power modules
Other electronic components
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