Low Viscosity, Two-Component, Silicone Potting Compound
Catalog NO.: AIMRSE-FOA-066 Category: Electronic Encapsulants
Low Viscosity, Two-Component, Silicone Potting Compound is a two-component, addition-curing silicone potting compound characterized by its low viscosity. It is designed for heat curing, with the characteristic that higher temperatures lead to faster curing. The curing reaction produces no by-products, making it safe for use on various material surfaces. It is suitable for long-term operation in a wide temperature range from -60°C to 220°C.
| Appearance | A: Grey B: White |
| Viscosity | 2000-3000 cP |
| Dielectric Constant | ≥ 13 kV/mm |
| Thermal Conductivity | ≥ 0.5 W/(m·k) |
| Hardness | 50-60 |
| Volume Resistivity | ≥ 10 13 Ω·cm |
| Mix Ratio By Weight | 1:1 |
◈ Low Viscosity: Has a mixed viscosity of 2,000-3,000 cp, allowing for good flow and penetration.
◈ Wide Operating Temperature: Suitable for long-term use in a broader range from -60°C to 220°C.
◈ Material Compatibility: Safe for use on a wide range of surfaces, including PC, PP, ABS, PVC, and various metals.
◈ Controlled Curing: Offers a room-temperature working time of 50-80 minutes and cures predictably with heat. It is a two-part system mixed in a 1:1 ratio by weight.
Primarily used for potting, heat dissipation, and protection of:
Power modules
Other electronic components
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