Magnetron Sputtering System/ 12 Sputtering Sources
Catalog NO.: AIMRSE-NRDE-003 Category: Nanotechnology R&D Equip
Magnetron Sputtering System is a high-vacuum sputtering system designed for depositing high-quality thin films. It features up to 12 sputtering sources with adjustable target-to-substrate distance and supports DC, pulsed DC, RF, and HiPIMS power supplies, suitable for complex multilayer and alloy films.
◈ High-Vacuum Environment: Ensures high-quality film deposition.
◈ High Capacity Sputtering Sources: Up to 12 sources with adjustable target-to-substrate distance.
◈ Versatile Power Options: Supports DC, pulsed DC, RF, and HiPIMS power supplies.
◈ Broad Temperature Control: Substrates can be heated to high temperatures or cooled to low temperatures.
◈ High Precision: High-precision control of deposition rate and film thickness ensures excellent uniformity and repeatability.
◈ Excellent Adhesion: Produces films with strong adhesion.
◈ Automation: PLC + PC fully automatic control.
◈ Optional Modules: Load lock for automatic sample loading, ion beam cleaning/assisted deposition, and RF plasma cleaning.
◈ Process Capabilities: Suitable for sputtering multi-layer films, co-sputtering alloy films, and reactive sputtering.
Depositable materials include metals, semiconductors, and dielectric materials.
Suitable for multilayer thin film sputtering and co-sputtering alloy thin films.
Applicable for research and development (R&D), pilot production, or mass production.
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