Magnetron Sputtering System/ 6 Sputtering Sources

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Magnetron Sputtering System/ 6 Sputtering Sources

Catalog NO.: AIMRSE-NRDE-001 Category: Nanotechnology R&D Equip

Magnetron Sputtering System is a high-vacuum sputtering system designed for depositing high-quality thin films of metals, semiconductors, and dielectric materials. It features up to 6 sputtering sources with adjustable target-to-substrate distance and supports DC, pulsed DC, RF, and HiPIMS power supplies.

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Broad Temperature Control: Substrates can be heated to high temperatures or cooled to low temperatures.
High Precision: High-precision control of deposition rate and film thickness ensures excellent uniformity and repeatability.
Excellent Adhesion: Produces films with strong adhesion.
Automation: PLC + PC fully automatic control.
Optional Modules: Load lock for automatic sample loading, ion beam cleaning/assisted deposition, and RF plasma cleaning.

Depositable materials include metals, semiconductors, and dielectric materials.
Suitable for multilayer thin film sputtering and co-sputtering alloy thin films.
Applicable for research and development (R&D), pilot production, or mass production.

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