Magnetron Sputtering System
Catalog NO.: AIMRSE-NRDE-004 Category: Nanotechnology R&D Equip
Magnetron Sputtering System is designed for pilot and mass production. It features a high-vacuum environment, multiple sputtering sources with adjustable distance, and supports DC, pulsed DC, RF, and HiPIMS power supplies. It is capable of batch substrate coating.
◈ Production-Oriented Design: Designed for pilot and mass production with batch sample coating capability.
◈ High Vacuum Environment: Ensures high-quality film deposition.
◈ Multiple Sputtering Sources: Features multiple sputtering sources with adjustable target-to-substrate distance.
◈ Versatile Power Options: Supports DC, pulsed DC, RF, and HiPIMS power supplies.
◈ Broad Temperature Control: Substrates can be heated or cooled.
◈ High Precision: High-precision control of deposition rate and film thickness ensures excellent uniformity and repeatability.
◈ Excellent Adhesion: Produces films with strong adhesion.
◈ Automation: PLC + PC fully automatic control.
◈ Optional Modules: Load lock for automatic sample loading and ion beam cleaning/assisted deposition.
Suitable for sputtering multi-layer films, co-sputtering alloy films, and reactive sputtering.
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