Medium-Viscosity High Thermal Conductivity Potting Compound
Catalog NO.: AIMRSE-FOA-064 Category: Electronic Encapsulants
Medium-Viscosity High Thermal Conductivity Potting Compound is a two-component, addition-curing, high thermal conductivity potting compound with medium viscosity. It is designed for heat curing, with the characteristic that higher temperatures lead to faster curing. The curing reaction produces no by-products, making it safe for use on various material surfaces. It is suitable for long-term operation in environments ranging from -40°C to 200°C.
| Viscosity | 12000-18000 cP |
| Dielectric Constant | ≥ 13 kV/mm |
| Thermal Conductivity | ≥ 3.0 W/(m·k) |
| Hardness | 10-20 |
| Curing Time | 4-6 h |
| Volume Resistivity | ≥ 10 13 Ω·cm |
| Mix Ratio By Weight | 1:1 |
◈ High Thermal Conductivity: Offers excellent heat dissipation with a thermal conductivity of ≥3.0 W/m·K.
◈ Material Compatibility: Safe for use on a wide range of surfaces, including PC (Polycarbonate), PP, ABS, PVC, and various metals.
◈ Controlled Curing: Features a room-temperature working time of 60-90 minutes and cures with heat. It is a two-part system mixed in a 1:1 ratio by weight.
Primarily used for potting, heat dissipation, and protection of:
Power modules
Other electronic components
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