Metal Film Deposition PVD System
Catalog NO.: AIMRSE-NRDE-038 Category: Nanotechnology R&D Equip
Metal Film Deposition PVD System consists of an atmospheric platform, vacuum transfer platform, degas chamber, pre-clean chamber, and process chambers capable of depositing multiple materials like Ta, TaN, and Cu. Its cluster architecture efficiently completes copper seed and barrier layer deposition with good filling capability.
◈ Unique magnetron sputtering source and chamber structure design effectively improves target utilization.
◈ The high ionization rate magnetron sputtering source design delivers excellent step coverage.
◈ A unique electrostatic chuck design provides excellent cooling performance.
◈ Optimized process flow results in high throughput and low operating costs.
Deposition of copper seed layers and barrier layers (e.g., Ta/TaN) in advanced interconnect structures.
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