Microcrystalline Glass Plasma Etching Equipment Cavity
Catalog NO.: AIMRSE-SEC-007 Category: Specialty Electronic Ceramics
The CNC precision machining of glass-ceramic used in plasma etching equipment cavities faces multiple challenges. Glass-ceramic combines high hardness (Mohs hardness 6.5-7) with brittleness, making it prone to chipping and microcracks during machining. Furthermore, it must meet the requirements of inner wall roughness Ra ≤ 0.01μm and μm-level flatness, which places extremely stringent demands on machining accuracy control.
| Size | Customizable |
| Machining Accuracy | 0.01 mm |
| Roughness | 0.1 μm |
| Material Composition | Microcrystalline glass |
◈ Material Properties: Microcrystalline glass, combining hardness (Mohs 6.5-7) with brittleness.
◈ Ultra-High Precision Machining: Requires CNC machining to achieve demanding specifications.
◈ Customizable: Can be customized according to customer drawings with high processing precision.
Plasma etching equipment chambers.
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