Multi-Chamber Magnetron Sputtering System
Catalog NO.: AIMRSE-NRDE-005 Category: Nanotechnology R&D Equip
Multi-Chamber Magnetron Sputtering System is an advanced system with multiple sputtering chambers, each maintaining a high-vacuum environment and configurable with single or multiple sources. It supports DC, pulsed DC, RF, and HiPIMS power supplies and features automated sample transfer between chambers for complex processes without breaking vacuum.
◈ Multi-Chamber Design: Multiple interconnected sputtering chambers for complex, multi-step processes.
◈ High-Vacuum Environment: Each chamber maintains a high-vacuum environment.
◈ Flexible Source Configuration: Each chamber can be configured with a single or multiple sputtering sources.
◈ Versatile Power Options: Supports DC, pulsed DC, RF, and HiPIMS power supplies.
◈ Broad Temperature Control: Substrates can be heated to high temperatures or cooled to low temperatures.
◈ High Precision: High-precision control of deposition rate and film thickness ensures excellent uniformity and repeatability.
◈ Excellent Adhesion: Produces films with strong adhesion.
◈ Automated Sample Handling: Includes load lock, sample automatic transfer between chambers, degassing treatment, and plasma cleaning.
Depositable materials include metals, semiconductors, and dielectric materials.
Suitable for multilayer thin film sputtering and co-sputtering alloy thin films.
Applicable for research and development (R&D), pilot production, or mass production.
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