One-Component Dealcoholized Adhesive Sealant (1.55-1.65 g/cm3)
Catalog NO.: AIMRSE-FOA-059 Category: Electronic Encapsulants
One-Component Dealcoholized Adhesive Sealant is a one-component, dealcoholized RTV silicone sealant designed for general industrial and electronic applications. It cures at room temperature upon exposure to moisture and is known for its rapid curing.
| Density | 1.55-1.65 g/cm3 |
| Appearance | White paste |
| Dielectric Constant | ≥ 15 kV/mm |
| Tensile Strength | ≥ 1.0 MPa |
| Elongation | ≥ 120% |
| Hardness | 50-60 |
| Volume Resistivity | ≥ 10 13 Ω·cm |
◈ Fast Curing: Features a short tack-free time and a fast overall curing speed.
◈ Good Storage & Performance: Has a long shelf life, and offers excellent impact resistance, weatherability, and electrical insulation properties.
◈ Non-Corrosive: Exhibits low yellowing after curing and is non-corrosive to materials like copper.
◈ Wide Temperature Range: Maintains reliable performance over a long period from -40°C to 200°C.
Bonding and sealing for LED guard tubes and bulb lamps in the optoelectronics industry.
Bonding and fixing of electronic components.
Surface bonding and sealing for mechanical equipment.
Thermally conductive bonding between high-power electronic modules and heat sinks.
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