One-Component Oxime-Cure Adhesive Sealant (1.38-1.45 g/cm3)
Catalog NO.: AIMRSE-FOA-050 Category: Electronic Encapsulants
One-Component Oxime-Cure Adhesive Sealant is a specialized one-component, oxime-type sealant designed for demanding industrial applications. It is primarily used for the bonding and sealing of aluminum frames in solar photovoltaic modules. Additionally, its low-viscosity variant is suitable for the shallow potting of electronic components.
| Density | 1.38-1.45 g/cm3 |
| Appearance | Grey |
| Viscosity | 55000-75000 |
| Dielectric Constant | ≥ 13 kV/mm |
| Tensile Strength | ≥ 1.2 MPa |
| Elongation | ≥ 200% |
| Hardness | 25-35 |
◈ Exceptional Durability: Maintains reliable performance over a wide temperature range, from -40°C to 200°C.
◈ Aesthetic & Stable: Exhibits low yellowing after curing, ensuring a clean, long-lasting appearance.
◈ Robust Performance: Offers excellent impact resistance, weatherability, and outstanding electrical insulation properties.
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