One-Component Oxime-Cure Adhesive Sealant (1.40-1.45 g/cm3)
Catalog NO.: AIMRSE-FOA-049 Category: Electronic Encapsulants
One-Component Oxime-Cure Adhesive Sealant is a specialized one-component, oxime-type sealant designed for demanding industrial applications. It is primarily used for the bonding and sealing of aluminum frames in solar photovoltaic modules. Additionally, its low-viscosity variant is suitable for the shallow potting of electronic components.
| Density | 1.40-1.45 g/cm3 |
| Appearance | White |
| Dielectric Constant | ≥ 14 kV/mm |
| Tensile Strength | ≥ 2.5 MPa |
| Elongation | ≥ 500% |
| Hardness | 45-55 |
◈ Exceptional Durability: Maintains reliable performance over a wide temperature range, from -40°C to 200°C.
◈ Aesthetic & Stable: Exhibits low yellowing after curing, ensuring a clean, long-lasting appearance.
◈ Robust Performance: Offers excellent impact resistance, weatherability, and outstanding electrical insulation properties.
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