One-Component Thermally Conductive Silicone Gel (≥ 4.0 W/m·k)
Catalog NO.: AIMRSE-FOA-069 Category: Electronic Encapsulants
One-Component Thermally Conductive Silicone Gel is a one-component, thermally conductive silicone gel designed as a thermal interface material. It cures into a stable gel that fills the gap between heat-generating components and heat sinks or casings to improve heat dissipation.
| Density | 3.40 g/cm3 |
| Appearance | Pink paste |
| Thermal Conductivity | ≥ 4.0 W/(m·k) |
| Curing Time | 50-70 min/100°C ≥ 4 h/60°C |
| Volume Resistivity | ≥ 10 12 Ω·cm |
| Flame Retardant | V0 |
◈ Effective Thermal Management: Cures into a stable gel with excellent electrical insulation and thermal conductivity.
◈ Durable & Stable: Offers excellent resistance to high and low temperatures (-40 to 200°C), weathering, and aging, ensuring long-term stable performance.
◈ Safe & Environmentally Friendly: Non-toxic and odorless. Compliant with stringent EU REACH and RoHS directives.
Used as a thermal interface material for filling gaps between hot components and heat sink casings in various electronic devices, including:
Smartphones: For heat dissipation from CPUs and memory chips.
Power Modules & Integrated Circuits: For thermal management.
Automotive Electronics: In controllers and other modules.
Telecommunications Equipment, Computers, and their accessories.
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