PECVD System
Catalog NO.: AIMRSE-NRDE-026 Category: Nanotechnology R&D Equip
PECVD System is designed for depositing silicon oxide, silicon nitride, and silicon oxynitride films using silane-based reactants. It is suitable for integrated circuits and power semiconductors, processing 12-inch wafers automatically.
◈ Multi-step deposition ensures superior film uniformity and high throughput.
◈ High- and low-frequency RF systems ensure uniform RF power distribution at every point.
◈ The chambers feature a modular design, supporting SiO/SiN/SiON process switching.
◈ The platform can accommodate up to three chambers, with the number and location of chambers configurable according to customer needs.
Integrated circuits, power semiconductors.
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