Plasma Chemical Vapor Deposition System
Catalog NO.: AIMRSE-NRDE-031 Category: Nanotechnology R&D Equip
Plasma Chemical Vapor Deposition System is a PECVD system suitable for 4-8 inch wafers in IC, MEMS, power, compound semiconductor, LED, R&D, and emerging fields. It supports various substrates and multiple film deposition processes with low cost, excellent performance, and a wide process window.
◈ Advanced single-wafer and multi-wafer architectures meet the needs of mass production and R&D customers.
◈ High-efficiency transport system with intelligent software scheduling algorithms.
◈ High-efficiency remote plasma cleaning system with excellent particle control.
◈ Supports processes such as gaseous silane, liquid TEOS, BPSG, FSG, and carbon film.
◈ Supports cleaning endpoint monitoring.
4-8 inch IC, MEMS, power devices, compound semiconductors, LED manufacturing, and scientific research.
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