Plasma Deep Silicon Etcher
Catalog NO.: AIMRSE-NRDE-044 Category: Nanotechnology R&D Equip
Plasma Deep Silicon Etcher is a 12-inch deep silicon etcher capable of hosting up to 6 independent reaction chambers. It utilizes zone gas inlet and fast gas switching systems, compatible with Bosch and Non-Bosch processes for etching TSV and trenches of various sizes.
◈ Multi-Chamber Capacity: Can simultaneously host up to 6 independent reaction chambers.
◈ Versatile Process Compatibility: Compatible with both Bosch and Non-Bosch processes.
◈ Precise Profile Control: Achieves smooth sidewall profiles and strict angle control for deep silicon etching.
◈ Advanced Gas System: Utilizes zone gas inlet and fast gas switching systems.
12-inch deep silicon etching for through-silicon vias (TSV) and trenches requiring precise profile control.
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