Plasma Dicing Etcher
Catalog NO.: AIMRSE-NRDE-062 Category: Nanotechnology R&D Equip
Plasma Dicing Etcher is an 8/12-inch etching equipment developed based on inductively coupled plasma technology, configurable with up to 4 reaction chambers. Primarily used for frame-level plasma dicing, it provides efficient, precise etching depth, uniformity control, and cross-wafer stability.
◈ High-density plasma and gas rapid switching device for precise process control.
◈ Higher chip dicing efficiency (parallel dicing).
◈ Superior particle size and yield performance, non-destructive dicing.
◈ Suitable for various dicing lane size requirements.
Advanced packaging.
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