Plasma-Enhanced Atomic Layer Thin Film Deposition System
Catalog NO.: AIMRSE-NRDE-024 Category: Nanotechnology R&D Equip
Plasma-Enhanced Atomic Layer Thin Film Deposition System is a CVD equipment designed for silicon dioxide film filling in through-silicon vias. It is applicable in integrated circuits, advanced packaging, emerging applications, and scientific research, enabling fully automated processing of 12-inch wafers.
◈ Four-chamber design for high throughput.
◈ High film quality and superior step coverage.
◈ Precise film thickness control and excellent uniformity.
◈ Uniform airflow, temperature, and RF field design ensures consistent film performance.
Integrated circuits, advanced packaging (TSV), emerging applications, and scientific research.
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