Plasma High Selectivity Etcher
Catalog NO.: AIMRSE-NRDE-045 Category: Nanotechnology R&D Equip
Plasma High Selectivity Etcher is a 12-inch plasma etcher designed for high selectivity, low plasma damage, and ultra-high precision etching of silicon, dielectrics, and metals. It is suited for advanced logic chip processes in the post-Moore era and lateral etching in 3D structures.
◈ Advanced plasma control technology ensures excellent uniformity.
◈ Ultra-high ion filtration efficiency allows for precise control of reaction energy.
◈ Higher etching selectivity allows for a wider range of etching materials.
Advanced logic chip manufacturing requires high selectivity and low-damage etching, including 3D structure applications.
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