PVD AlN Sputter System
Catalog NO.: AIMRSE-NRDE-040 Category: Nanotechnology R&D Equip
PVD AlN Sputter System is a PVD system primarily used for AlN (Aluminum Nitride) buffer layer deposition processes on 2/4/6-inch substrates. It is a single process chamber system equipped with a transfer chamber and a cooling chamber.
◈ High-Quality Aluminum Nitride Film: Excellent thickness uniformity.
◈ Precise Control: Exceptional heating capability, precise temperature control, and superior vacuum performance.
◈ Compact Footprint: Small footprint for efficient space utilization.
◈ Simple & Flexible: Simple structure with flexible operation.
◈ Low Cost of Ownership: Easy maintenance and low operating costs.
Deposition of AlN buffer layers.
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