Silicon Etcher
Catalog NO.: AIMRSE-NRDE-050 Category: Nanotechnology R&D Equip
Silicon Etcher is primarily used for front-end-of-line (FEOL) silicon etching processes. It utilizes an ICP high-density plasma chamber and is suitable for poly-silicon, shallow trench isolation, and front-end trench etching in ICs and power semiconductors.
◈ ICP High-Density Plasma Source: Utilizes an ICP chamber for effective etching.
◈ Good Process Control: Capable of good profile control, etching uniformity, and defect control.
Suitable for integrated circuits and power semiconductors.
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