Sub-Atmospheric Pressure Chemical Vapor Deposition (SACVD) Equipment
Catalog NO.: AIMRSE-NRDE-022 Category: Nanotechnology R&D Equip
Sub-Atmospheric Pressure Chemical Vapor Deposition (SACVD) Equipment is a sub-atmospheric pressure chemical vapor deposition system. The process chamber is mounted on a high-productivity PECVD platform proven in mass production, primarily used for gap fill in structures with relatively high aspect ratios, such as STI and PMD/ILD.
◈ Flexible Chamber Configuration: Can be configured with 1-3 process chambers.
◈ Advanced Process Capability: Can be configured with 1-3 liquid sources to realize various advanced processes.
◈ High-Quality Films: Deposits high-quality TEOS SiO2 and BPSG films.
◈ Size Compatibility: PF-200T SA is compatible with 8-inch wafer processing with conversion kits.
Gap fill applications in structures with relatively high aspect ratios, such as shallow trench isolation (STI), pre-metal dielectric (PMD), and inter-layer dielectric (ILD) layers.
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