Thermal Atomic Layer Deposition System
Catalog NO.: AIMRSE-NRDE-030 Category: Nanotechnology R&D Equip
Thermal Atomic Layer Deposition System is a thermal ALD system primarily used for depositing high-k dielectric material films on 12-inch wafers. It features excellent process stability control, superior film uniformity, and low particles, with a single-wafer-per-chamber design for consistent results.
◈ Excellent Process Control: Achieves superior film uniformity, repeatability, and low particle levels.
◈ Single-Wafer Chamber Design: Enhances consistency of single-wafer process results with excellent gas flow and temperature uniformity.
◈ Advanced Software: Fully automated process with data monitoring and safety interlocks for stable mass production.
◈ Designed for High-k Films: Specifically for high-k dielectric material deposition.
Integrated circuits, scientific research, and advanced packaging.
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