Thermal Evaporation Thin Film Deposition System
Catalog NO.: AIMRSE-NRDE-012 Category: Nanotechnology R&D Equip
Thermal Evaporation Thin Film Deposition System is a high-vacuum evaporation system designed for depositing high-quality thin films of metals, semiconductors, dielectric materials, and organic materials. It features precise rate and thickness control, suitable for single-layer, multi-layer, and LIFT-OFF processes, and can be equipped with a glovebox.
◈ High-Vacuum Environment: Ensures high-quality film deposition.
◈ High Precision: High-precision control of deposition rate and film thickness ensures excellent uniformity and repeatability.
◈ Versatile Material Deposition: Capable of depositing metals, semiconductors, dielectric materials, and organic materials.
◈ Optional Module: Ion beam cleaning or assisted deposition.
◈ Automation: PLC + PC fully automatic control.
◈ Process Capabilities: Suitable for single-layer, multi-layer films, co-evaporation of alloy films, and LIFT-OFF processes.
◈ Flexible Sample Stages: Multiple or custom sample stages for special process films.
◈ Glovebox Compatibility: Can be equipped with a glovebox for handling air-sensitive materials.
It can deposit metals, semiconductors, dielectric materials, and organic materials.
It can be used to deposit single-layer and multi-layer thin films.
It is used for research and development and pilot production.
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