TiN Metal HardMask Etcher

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TiN Metal HardMask Etcher

Catalog NO.: AIMRSE-NRDE-060 Category: Nanotechnology R&D Equip

TiN Metal HardMask Etcher is a 12-inch metal dry etcher designed for 40-28nm process node integrated circuits. It is used for etching TiN, HR (high-resistance), M0C, and HK (high-k) materials, as well as related processes.

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Advanced linewidth, topography, and uniformity control.
Multi-zone temperature-controlled electrostatic adsorption pads improve wafer temperature uniformity.
Low-damage pulsed plasma control technology.
Excellent throughput, process stability, and low defect control.

Integrated circuit.

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