TiN Physical Vapor Deposition System

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TiN Physical Vapor Deposition System

Catalog NO.: AIMRSE-NRDE-032 Category: Nanotechnology R&D Equip

TiN Physical Vapor Deposition System is a physical vapor deposition (PVD) system specifically designed for depositing titanium nitride (TiN) metal hard mask films. It is suitable for advanced semiconductor manufacturing processes.

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◈ Optimized industrial design meets user requirements for footprint and maintenance space.
◈ Unique magnetron sputtering source and chamber structure design effectively improves target utilization.
◈ Flexible configuration, high production capacity, and low operating costs.

Deposition of TiN metal hard mask layers in advanced semiconductor manufacturing.

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AIMRSE is a global technology leader committed to engineering excellence. As its specialized division, AeroTherm Advanced Insulation provides premier thermal management solutions spanning from -200°C to 1600°C+. We empower the EV, aerospace, and industrial sectors with high-performance aerogels, ceramics, and innovative insulation systems that ensure safety and energy efficiency in the most extreme environments.

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